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ltc2850/ltc2851/ltc2852 285012fd typical a pplica t ion fea t ures a pplica t ions descrip t ion 3.3v 20mbps rs485/rs422 transceivers the ltc ? 2850, ltc2851 and ltc2852 are low power, 20mbps rs485/rs422 transceivers operating on 3.3v supplies. the receiver has a one-eighth unit load supporting up to 256 nodes per bus (c, i-grade), and a failsafe feature that guarantees a high output state under conditions of floating or shorted inputs. the driver maintains a high output impedance over the entire common mode range when disabled or when the supply is removed. excessive power dissipation caused by bus contention or a fault is prevented by current limiting all outputs and by thermal shutdown. enhanced esd protection allows these parts to withstand up to 15kv (human body model) on the transceiver interface pins without latchup or damage. ltc2850 at 20mbps into 54 n 3.3v supply voltage n 20mbps maximum data rate n no damage or latchup up to 15kv hbm n high input impedance supports 256 nodes (c, i?grade) n operation up to 125c (h?grade) n guaranteed failsafe receiver operation over the entire common mode range n current limited drivers and thermal shutdown n delayed micropower shutdown: 5a maximum (c, i-grade) n power up/down glitch-free driver outputs n low operating current: 370a typical in receive mode n compatible with tia/eia-485-a specifications n available in 8-pin and 10-pin 3mm 3mm dfn, 8-pin and 10-pin msop, and 8-pin and 14-pin so packages n low power rs485/rs422 transceiver n level translator n backplane transceiver v cc1 gnd1 r ro1 re1 de1 di1 d r t ltc2850 ltc2850 r t 285012 ta01a v cc2 gnd2 r ro2 re2 de2 di2 d part number duplex package ltc2850 half so-8, msop-8, dfn-8 ltc2851 full so-8, msop-8, dfn-8 ltc2852 full so-14, msop-10, dfn-10 20ns/div 2v/div 285012 ta01b di a b a-b l , lt, ltc, ltm, linear technology and the linear logo are registered trademarks of linear technology corporation. all other trademarks are the property of their respective owners.
ltc2850/ltc2851/ltc2852 285012fd a bsolu t e maxi m u m r a t ings supply voltage (v cc ) ................................... C0.3v to 7v logic input voltages ( re , de, di) ................ C0.3v to 7v interface i/o: a, b, y, z ....................................... (v cc C 15v) to 15v receiver output voltage (ro) ....... C0.3v to (v cc + 0.3v) (note 1) pin con f igura t ion operating temperature (note 4) ltc285xc ................................................ 0c to 70c ltc285xi ............................................. C40c to 85c ltc285xh .......................................... C40c to 125c ltc285xmp ....................................... C55c to 125c storage temperature range .................. C65c to 150c lead temperature (soldering, 10 sec) msop ............................................................... 300c ltc2850 top view dd package 8-lead (3mm 3mm) plastic dfn 5 9 6 7 8 4 3 2 1 ro re de di v cc b a gnd t jmax = 150c, ja = 43c/w, jc = 3c/w exposed pad (pin 9) is gnd, must be soldered to pcb 1 2 3 4 ro re de di 8 7 6 5 v cc b a gnd top view ms8 package 8-lead plastic msop t jmax = 150c, ja = 200c/w, jc = 40c/w 1 2 3 4 8 7 6 5 top view v cc b a gnd ro re de di s8 package 8-lead plastic so t jmax = 150c, ja = 150c/w, jc = 39c/w ltc2851 top view dd package 8-lead (3mm 3mm) plastic dfn 5 6 7 8 4 3 2 1 v cc ro di gnd a b z y 9 t jmax = 150c, ja = 43c/w, jc = 3c/w exposed pad (pin 9) is gnd, must be soldered to pcb 1 2 3 4 v cc ro di gnd 8 7 6 5 a b z y top view ms8 package 8-lead plastic msop t jmax = 150c, ja = 200c/w, jc = 40c/w 1 2 3 4 8 7 6 5 top view a b z y v cc ro di gnd s8 package 8-lead plastic so t jmax = 150c, ja = 150c/w, jc = 39c/w ltc2852 top view dd package 10-lead (3mm 3mm) plastic dfn 10 11 9 6 7 8 4 5 3 2 1 v cc a b z y ro re de di gnd t jmax = 150c, ja = 43c/w, jc = 3c/w exposed pad (pin 11) is gnd, must be soldered to pcb 1 2 3 4 5 ro re de di gnd 10 9 8 7 6 v cc a b z y t op view ms package 10-lead plastic msop t jmax = 150c, ja = 120c/w, jc = 45c/w top view s package 14-lead plastic so 1 2 3 4 5 6 7 14 13 12 11 10 9 8 nc ro re de di gnd gnd v cc nc a b z y nc t jmax = 150c, ja = 88c/w, jc = 37c/w
ltc2850/ltc2851/ltc2852 285012fd pro d uc t selec t ion gui d e or d er in f or m a t ion ltc2850 c dd #tr pbf lead free designator pbf = lead free tape and reel tr = tape and reel package type dd = 8-lead plastic dfn dd = 10-lead plastic dfn ms8 = 8-lead plastic msop ms = 10-lead plastic msop s8 = 8-lead plastic so s = 14-lead plastic so temperature grade c = commercial temperature range (0c to 70c) i = industrial temperature range (C40c to 85c) h = automotive temperature range (C40c to 125c) mp = military temperature range (C55c to 125c) product part number ltc2850 = half duplex, with enables ltc2851 = full duplex, no enables ltc2852 = full duplex, with enables consult ltc marketing for information on non-standard lead based finish parts. for more information on lead free part marking, go to: http://www.linear.com/leadfree/ for more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ part number part marking duplex low power shutdown mode package ltc2850 2850/i/h, ltcqd, lcqc half yes so-8, msop-8, dfn-8 ltc2851 2851/i/h, ltcwf, lcwd full no so-8, msop-8, dfn-8 ltc2852 2852cs/is/hs, ltcrx, lcry full yes so-14, msop-10, dfn-10 ltc2850mp 2850mp, ltfyd, lfyc half yes so-8, msop-8, dfn-8 ltc2851mp 2851mp, ltfyg, lfyf full no so-8, msop-8, dfn-8 ltc2852mp 2852mps, ltfyh, lfyj full yes so-14, msop-10, dfn-10
ltc2850/ltc2851/ltc2852 285012fd e lec t rical c harac t eris t ics the l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at t a = 25c. v cc = 3.3v, unless otherwise noted. (note 2) symbol parameter conditions min typ max units driver |v od | differential driver output voltage r = , v cc = 3v (figure 1) r = 27 , v cc = 3v (figure 1) r = 50 , v cc = 3.13v (figure 1) l l l 1.5 2 v cc v cc v cc v v v |v od | difference in magnitude of driver differential output voltage for complementary output states r = 27 or 50 (figure 1) l 0.2 v v oc driver common mode output voltage r = 27 or 50 (figure 1) l 3 v |v oc | difference in magnitude of driver common mode output voltage for complementary output states r = 27 or 50 (figure 1) l 0.2 v i ozd driver three-state (high impedance) output current on y and z de = 0v, (y or z) = C7v, 12v (ltc2852) l 10 a i osd maximum driver short-circuit current C7v (y or z) 12v (figure 2) l C250 180 250 300 ma ma receiver i in receiver input current (a, b) de = te = 0v, v cc = 0v or 3.3v, v in = 12v (figure 3) (c, i-grade) de = te = 0v, v cc = 0v or 3.3v, v in = C7v, (figure 3) (c, i-grade) l l C100 125 a a de = te = 0v, v cc = 0v or 3.3v, v in = 12v (figure 3) (h-grade) de = te = 0v, v cc = 0v or 3.3v, v in = C7v, (figure 3) (h-grade) l l C145 250 a a r in receiver input resistance re = v cc or 0v, de = te = 0v, v in = C7v, C3v, 3v, 7v, 12v (figure 3) (c, i-grade) l 96 125 k re = v cc or 0v, de = te = 0v, v in = C7v, C3v, 3v, 7v, 12v (figure 3) (h-grade) l 48 125 k v th receiver differential input threshold voltage C7v b 12v l 0.2 v v th receiver input hysteresis b = 0v 25 mv v oh receiver output high voltage i(ro) = C4ma, a-b = 200mv, v cc = 3v l 2.4 v v ol receiver output low voltage i(ro) = 4ma, a-b = C200mv, v cc = 3v l 0.4 v i ozr receiver three-state (high impedance) output current on ro re = v cc , 0v ro v cc (ltc2850, ltc2852) l 1 a i osr receiver short-circuit current 0v ro v cc l 85 ma logic v ih logic input high voltage v cc = 3.6v l 2 v v il logic input low voltage v cc = 3v l 0.8 v i inl logic input current l 0 10 a
ltc2850/ltc2851/ltc2852 285012fd s wi t ching c harac t eris t ics note 1: stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. exposure to any absolute maximum rating condition for extended periods may affect device reliability and lifetime. high temperatures degrade operating lifetimes. operating lifetime is derated at temperatures greater than 105c. note 2: all currents into device pins are positive; all currents out of device pins are negative. all voltages are referenced to device ground unless otherwise specified. the l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at t a = 25c. v cc = 3.3v, unless otherwise noted. (note 2) symbol parameter conditions min typ max units driver f max maximum data rate (note 3) l 20 mbps t plhd , t phld driver input to output r diff = 54 , c l = 100pf (figure 4) l 10 50 ns t pd driver input to output difference |t plhd C t phld | r diff = 54 , c l = 100pf (figure 4) l 1 6 ns t skewd driver output y to output z r diff = 54 , c l = 100pf (figure 4) l 1 6 ns t rd , t fd driver rise or fall time r diff = 54 , c l = 100pf (figure 4) l 4 12.5 ns t zld , t zhd , t lzd , t hzd driver enable or disable time r l = 500 , c l = 50pf, re = 0v (figure 5) (ltc2850, ltc2852) l 70 ns t zhsd , t zlsd driver enable from shutdown r l = 500 , c l = 50pf, re = v cc (figure 5) (ltc2850, ltc2852) l 8 s t shdn time to shutdown r l = 500 , c l = 50pf, (de = , re = v cc ) or (de = 0v, re = ) (figure 5) (ltc2850, ltc2852) l 100 ns receiver t plhr , t phlr receiver input to output c l = 15pf, v cm = 1.5v, |v ab | = 1.5v, t r and t f < 4ns (figure 6) l 50 70 ns t skewr differential receiver skew |t plhr C t phlr | c l = 15pf (figure 6) l 1 6 ns t rr , t fr receiver output rise or fall time c l = 15pf (figure 6) l 3 12.5 ns t zlr , t zhr , t lzr , t hzr receiver enable/disable r l =1k, c l =15pf, de = v cc (figure 7) (ltc2850, ltc2852) l 50 ns t zhsr , t zlsr receiver enable from shutdown r l = 1k, c l = 15pf, de = 0v (figure 7) (ltc2850, ltc2852) l 8 s note 3: maximum data rate is guaranteed by other measured parameters and is not tested directly. note 4: this ic includes overtemperature protection that is intended to protect the device during momentary overload conditions. overtemperature protection activates at a junction temperature exceeding 150c. continuous operation above the specified maximum operating junction temperature may result in device degradation or failure. e lec t rical c harac t eris t ics the l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at t a = 25c. v cc = 3.3v, unless otherwise noted. (note 2) symbol parameter conditions min typ max units supplies i ccs supply current in shutdown mode de = 0v, re = v cc , ltc2850, ltc2852 (c and i-grade) ltc2850, ltc2852 (h-grade) l l 0 0 5 15 a a i ccr supply current in receive mode de = 0v, re = 0v (ltc2850, ltc2852) l 370 900 a i cct supply current in transmit mode no load, de = v cc , re = v cc (ltc2850, ltc2852) l 450 1000 a i cctr supply current with both driver and receiver enabled no load, de = v cc , re = 0v l 450 1000 a
ltc2850/ltc2851/ltc2852 285012fd tes t c ircui t s ? + driver di gnd or v cc r 285012 f01 y z r v oc ? + v od figure 1. driver dc characteristics figure 2. driver output short?circuit current figure 3. receiver input current and input resistance figure 4. driver timing measurement driver di gnd or v cc 285012 f02 y z + ? i osd ?7v to 12v + ? receiver 285012 f03 a or b v in i in b or a v in i in r in = driver di r diff c l c l 285012 f04a y z 1/2 v o 90% 90% 0 0 10% 285012 f04b 10% v o v cc y, z di (y-z) 0v t skewd t plhd t rd t fd t phld
ltc2850/ltc2851/ltc2852 285012fd figure 5. driver enable and disable timing measurements driver di v cc or gnd gnd or v cc v cc or gnd r l r l c l 285012 f05a y z de c l t zld , t zlsd t zhd , t zhsd t hzd , t shdn t lzd 1/2 v cc 1/2 v cc 1/2 v cc de y or z z or y v cc v cc v ol v o v oh 0v 0v 0.5v 0.5v 285012 f05b figure 6. receiver propagation delay measurements tes t c ircui t s a b v cm v ab /2 v ab /2 ro c l 285012 f06a receiver t plhr t phlr 90% 0 90% 10% t r 90% 10% t f t skewr = | t plhr ? t phlr | 90% 1/2 v cc 1/2 v cc t rr t fr 10% 285012 f06b 10% v ab v cc v o 0 ?v ab ro a-b a b 0v or v cc v cc or 0v ro re c l di = 0v or v cc r l v cc or gnd 285012 f07a receiver t zlr , t zlsr t zhr , t zhsr t hzr t lzr 1/2 v cc 1/2 v cc 1/2 v cc re ro ro v cc v cc v ol v o v oh 0v 0v 0.5v 0.5v 285012 f07b figure 7. receiver enable/disable time measurements
ltc2850/ltc2851/ltc2852 285012fd output current (ma) 0 0 output voltage (v) 2.0 3.0 3 4 5 6 285012 g07 3.5 2.5 1.0 1.5 0.5 1 2 sink source temperature (c) ?40 35 prop delay (ns) 55 65 0 40 80 120 285012 g08 70 60 40 45 50 ?20 20 60 100 data rate (mbps) 0.1 0 supply current (ma) 30 50 1 100 285012 g09 60 40 10 20 10 c l = 100pf r diff = 54 r diff = 100 r diff = temperature (c) ?40 80 output short-circuit current (ma) 120 140 0 40 80 120 285012 g04 150 130 90 100 110 ?20 20 60 100 sink v out = 3.3v source v out = 0v output current (ma) 0 0 output voltage (v) 2.0 3.0 30 40 50 70 285012 g05 3.5 2.5 1.0 1.5 0.5 10 20 60 v oh v ol temperature ( c) ?40 ?1 receiver skew (ns) 0 1 0 40 80 120 285012 g01 2 ?20 20 60 100 v ab = 1.5v c l = 15pf temperature (c) ?40 ?1.5 driver skew (ns) 0 1.0 0 40 80 120 285012 g02 1.5 0.5 ?1.0 ?0.5 ?20 20 60 100 r diff = 54 c l = 100pf temperature ( c) ?40 4 prop delay (ns) 12 16 0 40 80 120 285012 g03 18 14 6 8 10 ?20 20 60 100 r diff = 54 c l = 100pf typical p er f or m ance c harac t eris t ics receiver skew vs temperature driver skew vs temperature driver propagation delay vs temperature driver output short?circuit current vs temperature driver output low/high voltage vs output current driver differential output voltage vs temperature receiver output voltage vs output current (source and sink) receiver propagation delay vs temperature supply current vs data rate temperature (c) ?40 output voltage (v) 0 40 80 120 285012 g06 ?20 20 60 100 r diff = 54 r diff = 100 r diff = 0 2.0 3.0 3.5 2.5 1.0 1.5 0.5 t a = 25c. v cc = 3.3v, unless otherwise noted.
ltc2850/ltc2851/ltc2852 285012fd func t ion tables p in func t ions ro: receiver output. if the receiver output is enabled ( re low) and a > b by 200mv, then ro will be high. if a < b by 200mv, then ro will be low. if the receiver inputs are open, shorted, or terminated without a valid signal, ro will be high. re : receiver enable. a low enables the receiver. a high input forces the receiver output into a high impedance state. de: driver enable. a high on de enables the driver. a low input will force the driver outputs into a high impedance. if re is high with de low, the part will enter a low power shutdown state. di: driver input. if the driver outputs are enabled (de high), then a low on di forces the driver positive output low and negative output high. a high on di, with the driver outputs enabled, forces the driver positive output high and negative output low. gnd: ground. y: noninverting driver output for ltc2851 and ltc2852. high impedance when driver disabled or unpowered. z: inverting driver output for ltc2851 and ltc2852. high impedance when driver disabled or unpowered. a: noninverting receiver input (and noninverting driver output for ltc2850). impedance is >96k in receive mode or unpowered. b: inverting receiver input (and inverting driver output for ltc2850). impedance is >96k in receive mode or unpowered. v cc : positive supply. 3v < v cc < 3.6v. bypass with 0.1f ceramic capacitor. exposed pad: ground. the exposed pads on the dfn packages must be soldered to ground. ltc2850 logic inputs mode a, b ro de re 0 0 receive r in driven 0 1 shutdown r in hi-z 1 0 transceive driven driven 1 1 transmit driven hi-z ltc2852 logic inputs mode a, b y, z ro de re 0 0 receive r in hi-z driven 0 1 shutdown r in hi-z hi-z 1 0 transceive r in driven driven 1 1 transmit r in driven hi-z
ltc2850/ltc2851/ltc2852 0 285012fd b lock diagra m ltc2850 ltc2851 ltc2852 sleep/shutdown logic and delay receiver driver ro re de di a (15kv) v cc gnd b (15kv) 285012 bda receiver driver ro di 285012 bdb a (15kv) z (15kv) y (15kv) b (15kv) v cc gnd sleep/shutdown logic and delay receiver driver ro re de di 285012 bdc a (15kv) z (15kv) y (15kv) b (15kv) v cc gnd
ltc2850/ltc2851/ltc2852 285012fd a pplica t ions i n f or m a t ion driver the driver provides full rs485/rs422 compatibility. when enabled, if di is high, y-z is positive for the full-duplex devices (ltc2851, ltc2852) and a-b is positive for the half-duplex device (ltc2850). when the driver is disabled, both outputs are high im - pedance. for the full-duplex devices, the leakage on the driver output pins is guaranteed to be less than 10a over the entire common mode range of C7v to 12v. on the half-duplex ltc2850, the impedance is dominated by the receiver input resistance, r in . driver overvoltage and overcurrent protection the driver outputs are protected from short-circuits to any voltage within the absolute maximum range of (v cc C 15v) to 15v. the typical peak current in this condi - tion does not exceed 180ma. if a high driver output is shorted to a voltage just above v cc , a reverse current will flow into the supply. when this voltage exceeds v cc by about 1.4v, the reverse current turns off. preventing the driver from turning off with outputs shorted to output voltages just above v cc keeps the driver active even for receiver loads that have a positive common mode with respect to the driver a valid condition. the worst-case peak reverse short-circuit current can be as high as 300ma in extreme cold conditions. if this current can not be absorbed by the supply, a 3.6v zener diode can be added in parallel with the supply to sink this current. all devices also feature thermal shutdown protection that disables the driver and receiver in case of excessive power dissipation (see note 4 in the electrical characteristics section). receiver and failsafe with the receiver enabled, when the absolute value of the differential voltage between the a and b pins is greater than 200mv, the state of ro will reflect the polar - ity of (a-b) these parts have a failsafe feature that guarantees the receiver output to be in a logic-high state when the inputs are either shorted, left open, or terminated but not driven. this failsafe feature is guaranteed to work for inputs spanning the entire common mode range of C7v to 12v. the receiver output is internally driven high (to v cc ) or low (to ground) with no external pull-up needed. when the receiver is disabled the ro pin becomes hi-z with leakage of less than 1a for voltages within the supply range. receiver input resistance the receiver input resistance from a or b to ground is guaranteed to be greater than 96k (c, i-grade). this is 8x higher than the requirements for the rs485 standard and thus this receiver represents a one-eighth unit load. this, in turn, means that 8x the standard number of receivers, or 256 total, can be connected to a line without loading it beyond what is specified in the rs485 standard. the receiver input resistance from a or b to ground on high temperature h-grade parts is greater than 48k providing a one-quarter unit load. the high input resistance of the receiver is maintained whether it is enabled or disabled, powered or unpowered. supply current the unloaded static supply currents in these devices are very low, typically under 500a for all modes of opera - tion. in applications with resistively terminated cables, the supply current is dominated by the driver load. for example, when using two 120 terminators with a dif - ferential driver output voltage of 2v, the dc load current is 33ma, which is sourced by the positive voltage supply. power supply current increases with toggling data due to capacitive loading and this term can increase significantly at high data rates. figure 13 shows supply current vs data rate for two different capacitive loads for the circuit configuration of figure 4.
ltc2850/ltc2851/ltc2852 285012fd a pplica t ions i n f or m a t ion high speed considerations a ground plane layout is recommended. a 0.1f bypass capacitor less than one-quarter inch away from the v cc pin is also recommended. the pc board traces connected to signals a/b and z/y should be symmetrical and as short as possible to maintain good differential signal integrity. to minimize capacitive effects, the differential signals should be separated by more than the width of a trace and should not be routed on top of each other if they are on different signal planes. care should be taken to route outputs away from any sensitive inputs to reduce feedback effects that might cause noise, jitter, or even oscillations. for example, in the full-duplex devices, di and a/b should not be routed near the driver or receiver outputs. the logic inputs have 150mv of hysteresis to provide noise immunity. fast edges on the outputs can cause glitches in the ground and power supplies which are exacerbated by capacitive loading. if a logic input is held near its threshold (typically 1.5v), a noise glitch from a driver transition may exceed the hysteresis levels on the logic and data input 285012 f14 data rate (bps) cable length (ft) 10k 1m 10m 100k 100m 100 1k 10 10k rs485/rs422 max data rate ltc2850/ ltc2851/ltc2852 max data rate figure 14. cable length vs data rate (rs485/rs422 standard shown in solid line) pins causing an unintended state change. this can be avoided by maintaining normal logic levels on the pins and by slewing inputs through their thresholds by faster than 1v/s when transitioning. good supply decoupling and proper driver termination also reduce glitches caused by driver transitions. cable length vs data rate for a given data rate, the maximum transmission distance is bounded by the cable properties. a curve of cable length vs data rate compliant with the rs485/rs422 standards is shown in figure 14. three regions of this curve reflect different performance limiting factors in data transmis - sion. in the flat region of the curve, maximum distance is determined by resistive losses in the cable. the down - ward sloping region represents limits in distance and data rate due to ac losses in the cable. the solid vertical line represents the specified maximum data rate in the rs485/rs422 standards. the dashed lines at 20mbps show the maximum data rates of the ltc2850, ltc2851 and ltc2852. figure 13. supply current vs data rate data rate (mbps) 0.1 20 supply current (ma) 60 70 80 1 10 100 285012 f13 50 40 30 r diff = 54 c l = 1000pf c l = 100pf
ltc2850/ltc2851/ltc2852 285012fd typical a pplica t ions r d ltc2850 r d ltc2850 d te = 3.3v r d te = 3.3v 285012 ta03 r ltc2854 ltc2854 d v cc i 1 i 2 100k b a ?a? ?b? ro di ltc2850 285012 ta02 r failsafe 0 application (idle state = logic 0) multinode network with end termination using the ltc2850 and ltc2854
ltc2850/ltc2851/ltc2852 285012fd p ackage descrip t ion 3.00 p 0.10 (4 sides) note: 1. drawing to be made a jedec package outline m0-229 variation of (weed-2). check the ltc website data sheet for current status of variation assignment 2. drawing not to scale 3. all dimensions are in millimeters 4. dimensions of exposed pad on bottom of package do not include mold flash. mold flash, if present, shall not exceed 0.15mm on any side 5. exposed pad shall be solder plated 6. shaded area is only a reference for pin 1 location on the top and bottom of package 0.40 p 0.10 bottom view?exposed pad 1.65 p 0.10 (2 sides) 0.75 p 0.05 r = 0.125 typ 2.38 p 0.10 (2 sides) 1 5 10 6 pin 1 top mark (see note 6) 0.200 ref 0.00 ? 0.05 (dd) dfn rev c 0310 0.25 p 0.05 2.38 p 0.05 (2 sides) recommended solder pad pitch and dimensions 1.65 p 0.05 (2 sides) 2.15 p 0.05 0.50 bsc 0.70 p 0.05 3.55 p 0.05 package outline 0.25 p 0.05 0.50 bsc pin 1 notch r = 0.20 or 0.35 s 45 o chamfer 3.00 p 0.10 (4 sides) note: 1. drawing to be made a jedec package outline m0-229 variation of (weed-1) 2. drawing not to scale 3. all dimensions are in millimeters 4. dimensions of exposed pad on bottom of package do not include mold flash. mold flash, if present, shall not exceed 0.15mm on any side 5. exposed pad shall be solder plated 6. shaded area is only a reference for pin 1 location on top and bottom of package 0.40 p 0.10 bottom view?exposed pad 1.65 p 0.10 (2 sides) 0.75 p 0.05 r = 0.125 typ 2.38 p 0.10 1 4 8 5 pin 1 top mark (note 6) 0.200 ref 0.00 ? 0.05 (dd8) dfn 0509 rev c 0.25 p 0.05 2.38 p 0.05 recommended solder pad pitch and dimensions apply solder mask to areas that are not soldered 1.65 p 0.05 (2 sides) 2.10 p 0.05 0.50 bsc 0.70 p 0.05 3.5 p 0.05 package outline 0.25 p 0.05 0.50 bsc dd package 8?lead plastic dfn (3mm s 3mm) (reference ltc dwg # 05-08-1698 rev c) dd package 10?lead plastic dfn (3mm s 3mm) (reference ltc dwg # 05-08-1699 rev b)
ltc2850/ltc2851/ltc2852 285012fd p ackage descrip t ion ms8 package 8?lead plastic msop (reference ltc dwg # 05-08-1660 rev f) ms package 10?lead plastic msop (reference ltc dwg # 05-08-1661 rev e) msop (ms8) 0307 rev f 0.53 p 0.152 (.021 p .006) seating plane note: 1. dimensions in millimeter/(inch) 2. drawing not to scale 3. dimension does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.152mm (.006") per side 4. dimension does not include interlead flash or protrusions. interlead flash or protrusions shall not exceed 0.152mm (.006") per side 5. lead coplanarity (bottom of leads after forming) shall be 0.102mm (.004") max 0.18 (.007) 0.254 (.010) 1.10 (.043) max 0.22 ? 0.38 (.009 ? .015) typ 0.1016 p 0.0508 (.004 p .002) 0.86 (.034) ref 0.65 (.0256) bsc 0 o ? 6 o typ detail ?a? detail ?a? gauge plane 1 2 3 4 4.90 p 0.152 (.193 p .006) 8 7 6 5 3.00 p 0.102 (.118 p .004) (note 3) 3.00 p 0.102 (.118 p .004) (note 4) 0.52 (.0205) ref 5.23 (.206) min 3.20 ? 3.45 (.126 ? .136) 0.889 p 0.127 (.035 p .005) recommended solder pad layout 0.42 p 0.038 (.0165 p .0015) typ 0.65 (.0256) bsc msop (ms) 0307 rev e 0.53 0.152 (.021 .006) seating plane 0.18 (.007) 1.10 (.043) max 0.17 ?0.27 (.007 ? .011) typ 0.86 (.034) ref 0.50 (.0197) bsc 1 2 3 4 5 4.90 0.152 (.193 .006) 0.497 0.076 (.0196 .003) ref 8 9 10 7 6 3.00 0.102 (.118 .004) (note 3) 3.00 0.102 (.118 .004) (note 4) note: 1. dimensions in millimeter/(inch) 2. drawing not to scale 3. dimension does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.152mm (.006") per side 4. dimension does not include interlead flash or protrusions. interlead flash or protrusions shall not exceed 0.152mm (.006") per side 5. lead coplanarity (bottom of leads after forming) shall be 0.102mm (.004") max 0.254 (.010) 0 ? 6 typ detail ?a? detail ?a? gauge plane 5.23 (.206) min 3.20 ? 3.45 (.126 ? .136) 0.889 0.127 (.035 .005) recommended solder pad layout 0.305 0.038 (.0120 .0015) typ 0.50 (.0197) bsc 0.1016 0.0508 (.004 .002)
ltc2850/ltc2851/ltc2852 285012fd p ackage descrip t ion .016 ? .050 (0.406 ? 1.270) .010 ? .020 (0.254 ? 0.508) 45 0 ? 8 typ .008 ? .010 (0.203 ? 0.254) so8 0303 .053 ? .069 (1.346 ? 1.752) .014 ? .019 (0.355 ? 0.483) typ .004 ? .010 (0.101 ? 0.254) .050 (1.270) bsc 1 2 3 4 .150 ? .157 (3.810 ? 3.988) note 3 8 7 6 5 .189 ? .197 (4.801 ? 5.004) note 3 .228 ? .244 (5.791 ? 6.197) .245 min .160 .005 recommended solder p ad la yout .045 .005 .050 bsc .030 .005 typ inches (millimeters) note: 1. dimensions in 2. drawing not to scale 3. these dimensions do not include mold flash or protrusions. mold flash or protrusions shall not exceed .006" (0.15mm) 1 n 2 3 4 .150 ? .157 (3.810 ? 3.988) note 3 14 13 .337 ? .344 (8.560 ? 8.738) note 3 .228 ? .244 (5.791 ? 6.197) 12 11 10 9 5 6 7 n/2 8 .016 ? .050 (0.406 ? 1.270) .010 ? .020 (0.254 ? 0.508) 45 0 ? 8 typ .008 ? .010 (0.203 ? 0.254) s14 0502 .053 ? .069 (1.346 ? 1.752) .014 ? .019 (0.355 ? 0.483) typ .004 ? .010 (0.101 ? 0.254) .050 (1.270) bsc .245 min n 1 2 3 n/2 .160 .005 recommended solder p ad la yout .045 .005 .050 bsc .030 .005 typ inches (millimeters) note: 1. dimensions in 2. drawing not to scale 3. these dimensions do not include mold flash or protrusions. mold flash or protrusions shall not exceed .006" (0.15mm) s8 package 8?lead plastic small outline (narrow .150 inch) (reference ltc dwg # 05-08-1610) s package 14?lead plastic small outline (narrow .150 inch) (reference ltc dwg # 05-08-1610)
ltc2850/ltc2851/ltc2852 285012fd information furnished by linear technology corporation is believed to be accurate and reliable. however, no responsibility is assumed for its use. linear technology corporation makes no representa - tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. r evision h is t ory rev date description page number d 05/10 added military grade parts. 2, 3 (revision history begins at rev d)
ltc2850/ltc2851/ltc2852 285012fd linear technology corporation 1630 mccarthy blvd., milpitas, ca 95035-7417 (408) 432-1900 fax : (408) 434-0507 www.linear.com ? linear technology corporation 2007 lt 0510 rev d ? printed in usa r ela t e d p ar t s typical a pplica t ion part number description comments ltc485 low power rs485 interface transceiver i cc = 300a (typ) ltc491 differential driver and receiver pair i cc = 300a ltc1480 3.3v ultralow power rs485 transceiver 3.3v operation ltc1483 ultralow power rs485 low emi transceiver controlled driver slew rate ltc1485 differential bus transceiver 10mbps operation ltc1487 ultralow power rs485 with low emi, shutdown and high input impedance up to 256 transceiver on the bus ltc1520 50mbps precision quad line receiver channel-to-channel skew 400ps (typ) ltc1535 isolated rs485 full-duplex transceiver 2500v rms isolation in surface mount package ltc1685 52mbps rs485 transceiver with precision delay propagation delay skew 500ps (typ) lt1785 60v fault protected rs485 transceiver 60v tolerant, 15kv esd ltc2854/ltc2855 3.3v 20mbps rs485/rs422 transceivers with integrated switchable termination 3.3v operation, integrated, switchable, 120 termination resistor, 25kv esd (ltc2854), 15kv esd (ltc2855) ltc2856-1 20mbps and slew rate-limited, 15kv rs485/rs422 transceiver 15kv esd ltc2859/ltc2861 20mbps rs485/rs422 transceiver with integrated switchable termination integrated, switchable, 120 termination resistor, 15kv esd full duplex network using the ltc2852 and ltc2855 d te = 3.3v 120 r ltc2855 master r d ltc2852 slave te = 3.3v 285012 ta04 d r ltc2855 slave r d ltc2852 slave

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